TBSTest 2024 Beijing Regional Technical Seminar was successfully held!

On May 22, 2024, TBSTest Beijing regional Technical Seminar was successfully held in Beijing. This seminar attracted the active participation of experts, scholars and practitioners from more than 30 enterprises and institutions in the IC industry chain, covering excellent representatives from many technical fields such as design, testing, manufacturing and packaging. At the meeting, TBSTest and industry elites gathered together to deeply discuss the development status, future trends and innovative applications of new technologies and new systems for domestic IC testing, fully reflecting the theme of "hand in hand • Test China's 'chip' power".

With the continuous innovation of the domestic IC industry and the continuous expansion of application scenarios, the advanced testing technology of domestic IC is also constantly bringing new opportunities and vitality to the industry. The international advanced test technology innovation and trade and other issues exacerbate the risk of "stuck neck". TBSTest is committed to becoming an excellent domestic ATE manufacturer "born for China and tested for the world", which not only requires hard work, but also needs to deepen cooperation and exchanges with industry partners, demonstrating the win-win business philosophy that TBSTest has always upheld.

Aimin Yang, executive deputy general manager of TBSTest, said in his opening speech that as a leading IC test system supplier in the industry, TBSTest has always promoted the level of domestic ATE technology as its foundation. The self-developed SOC automated test system T800 series, memory chip automated test system TM8000 series, and IGBT automated test system TP series have established close cooperation with many head customers in downstream fields, such as Fab plants, design companies, testing institutions, photovoltaic and new energy enterprises, etc. Many practical applications are realized. These solutions are industry-leading in addressing key metrics such as test speed, accuracy, and flexibility.

Many technical experts from TBSTest shared advanced solutions and innovative achievements such as large-scale digital chip testing, MCU efficient testing, embedded memory testing, mixed signal testing, RF SOC testing, Flash memory chip testing system, etc. The wonderful keynote speeches and lively discussions created many wonderful moments of the seminar, and everyone explored new stories of cooperation together.

The workshop also held a number of case sharing and technical demonstrations, and the application of various innovative technologies in the field of IC testing provided the participants with a full range of understanding and communication opportunities. Some participants said that through this seminar, they are more optimistic about the development prospects of China's IC, and will continue to work hard to realize the dream of China's "chip" power.

The successful holding of this seminar also provides a valuable opportunity for exchanges and cooperation between industries. We look forward to seeing more technological innovation and industrial development in the future to jointly promote the vigorous development of China's IC industry.

We would like to thank all the experts, scholars and guests for their support and look forward to meeting again in the future. Jointly measure the power of China's "chip", jointly witness the rise of China's IC industry, and jointly draw the future "chip" blueprint of the IC industry.