Beyond Innovation, Helping China's "Core" ---- TBSTest 2019 Shenzhen Testing Technology Seminar Held Successfully

  On December 11, 2019, TBSTest 2019 annual test technology seminar was successfully held in Shenzhen. "Beyond innovation, helping China's" core "" is the core theme of the company's technical seminar. Some of the parameter indicators of the company's independently developed SOC test equipment T800 series and Memory test equipment ATE equipment suppliers, we also hope to try out test solution innovation in some specific product testing areas, and help the domestic chip industry grow rapidly with more suitable testing technology services.

This technical seminar brought together more than 20 companies and partners from chip design, packaging and testing, and related upstream and downstream industry chains in Shenzhen and surrounding areas. TBSTest aimed at high-end application chip market, with all participating professionals Share and exchange our understanding of the current status and future development of testing techniques, and discuss the needs and pain points of customers in the domestic industry. Through this technical seminar, we not only deepened our mutual understanding with local industry customers, but as the company's business in the southern region expands, we will gradually improve the testing service capabilities of the southern market and better support local industry customers and technical cooperation. Partners to achieve a win-win common development goal.